The Expert Talks webinar series offers in-depth discussions with experts on diverse topics.

The virtual gathering experience of the packaging industry: Conference + In-house Exhibition + Networking

Welcome to the Henkel Flix metal pretreatment web-seminar series where you can find valuable information about BONDERITE^® products and equipment. Register now!

Henkel offers a comprehensive training portfolio supporting professionals at tape and label producers, printers or manufacturers of PSA-based specialties

Learn more about Henkel's optimized material solutions for next generation automotive structural bonding

Discover Henkel's webinar series designed to keep you up-to-date on the latest technology innovations for metal packaging.

Learn more about Henkel's and Covestro's solution for efficient EV battery cell assembly

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...