Learn more about Henkel's highly reliable solutions for Electronic Control Units (ECU).

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...

The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.

On Oct 13, join Henkel to learn how material solutions are enabling a no compromise approach to next generation vehicle design and manufacturing.

Learn more about Henkel - Innovative Assembly, Protection & Thermal Solutions for ADAS

Lean how Henkel is Developing a Bond You Can Trust, with our Solutions for Automotive Interiors.

Learn about design, performance and processing of the silicone free cure-in-place gel for ADAS and industrial applications.