The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi

With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.

Henkel offers a comprehensive training portfolio supporting professionals at tape and label producers, printers or manufacturers of PSA-based specialties

Be food safe with Henkel solutions and join the free webinar

Be food safe with Henkel solutions and join the free webinar

The RoHS directive has been well-publicized but often not fully understood. This webinar provides updates on the requirements of the legislation and how, in light of the move to lead-free, electronics assembly professionals can achieve high reliability.

The webinar provides information on when to make the switch to Pb-free in the automotive and industrial markets, receive detailed reliability comparisons of SnPb versus Pb-free alloys, discussion of failure mechanisms and the limitations of SAC alloys, information on the distinction between a differentiation standard and high reliability and much, much more.

Author: Ian Wilding

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...

Industry experts Jan Vardaman of TechSearch International and Davy Nakada of Henkel Corporation discuss the market conditions driving a new approach to high thermal conductive die attach materials and processes.