The Expert Talks webinar series offers in-depth discussions with experts on diverse topics.

Welcome to the Henkel Flix metal pretreatment web-seminar series where you can find valuable information about BONDERITE^® products and equipment. Register now!

On September 22, join us to learn more about how digital solutions like Augmented Reality glasses are transforming line management and boosting sustainability.

Welcome to the Henkel Printed Electronics ThINK Together Event Page –
A showcase for our digital events, offering first-hand insights on

• latest material innovations for stretchable, flexible & high-speed printable electronics,
• material processing advice to improve your screen printability
• recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces

Grab a coffee and listen into our latest video podcasts.

Greater network bandwidth and data processing, Wi-Fi 6 enterprise systems and 5G infrastructure devices require higher power ICs and larger CPUs within high-density electronic designs.

Discover Henkel's automotive web-seminar series designed to keep you up-to-date on the latest technology innovations

Learn more about Henkel's highly reliable solutions for Electronic Control Units (ECU).

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...

The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi