Food Safe Packaging webinar: Advanced migration testing for food safe packaging solutions Be food safe with Henkel solutions and join the free webinar Read More
Customizable Silicone Materials for MEMS and Semiconductor Packages Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years. Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique... Read More
Food Safe Packaging webinar: Fundamentals of global legislation for adhesives in food contact Be food safe with Henkel solutions and join the free webinar Read More
Smart Card Market Trends and Integrated Adhesive Solutions The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control. Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability. Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials. Author: Jinu Choi Read More
EMI Shielding Solutions for Semiconductor Packages With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation. As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level. This webinar will cover Henkel’s latest materials, application process, test methods, and performance. Authors: Jinu Choi, Xinpei Cao, Dan Maslyk Read More
Web-Seminar on Unique Remote Monitoring System for Data Analysis Learn more about Henkel’s Bonderite® LineguardX Optimizes Chemical Processing Systems Read More
Web-Seminar on EV Battery Cell Assembly Learn more about Henkel's and Covestro's solution for efficient EV battery cell assembly Read More
Web-Seminar on Next Generation Structural Adhesives Learn more about Henkel's optimized material solutions for next generation automotive structural bonding Read More
Henkel Expert Talks: Telecom & Datacom Infrastructure Advance Materials for High Performance Telecom and Datacom Applications Read More
