Over the past decade, we have seen a significant growth in the mobile computing market which has propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies in order to continue boosting performance and functionality per market demands.

Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages.

In this webinar, we will cover Henkel’s broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip- chip interconnect technology across different market segments. Fine pitch Cu Pillar...

In order to support the drive to flexible, printed electronics Henkel has developed a series of new, highly conductive silver inks. Main differentiator of the new inks compared to available inks is their very high electrical conductivity combined with high levels of flexibility. On the one hand, these inks open up new possibilities for printed electronic applications and on the other hand they offer the possibility to significantly reduce the total cost of ownership in existing print applications by reducing track width and/or height. Get involved now and find out more about these new, sustainable, high conductive flexible silver inks.

Author: Sharona Sente

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference (EMI). Radio-frequency (RF) emitting devices require effective isolation to limit the propagation of their interference to neighboring components to protect the end device from performance degradation.

As electronics move toward miniaturization, lighter weight, and higher speeds, these challenges become more significant as conventional shielding methods present functional and operational limitations. To address this, the Faraday cage is applied directly at the package level.

This webinar will cover Henkel’s latest materials, application process, test methods, and performance.

Authors: Jinu Choi, Xinpei Cao, Dan Maslyk

Micro Electro Mechanical Systems (MEMS) are driving the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector which is driving MEMS growth, smartphones today can contain as many as ten to twelve — or even more — MEMS devices, with this number projected to grow in the coming years.

Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive’s modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, Henkel has developed a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique...

Technology advancement continues to push the semiconductor industry towards ever thinner and higher functioning devices. Henkel introduces the LOCTITE ABLESTIK CDF family of products as a solution that allows robust processing of thinner, smaller, higher-density packages with reduced footprints. This ground-breaking conductive die attach film technology has been brought to the market in a pre-cut format, which enables robust manufacturing. Henkel now offers a portfolio of products which cater to consumer and automotive applications, combining an efficient process with higher reliability (MSL1 packages).

In this webinar, Dr. Gupta will cover the commercial success of products launched over the past years and also introduce participants to the latest developments in Silver Sintering Film technology as a viable Pb Free replacement. He will focus on market drivers, the motivation for developing cDAF products and their advantages in resolving manufacturing and reliability challenges...

Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. With the wide variety of applications requiring thermal management, the need for alternative thermal material solutions and innovative material placement methods continues to grow. In response, Bergquist and Henkel have developed and supply a variety of highly efficient, flexible and easy to handle thermally conductive interface materials to meet current and future needs for effectively cooling electronic systems ensuring long-term reliability.

One of those materials are Polymer-based dispensable Gap Fillers with unique characteristics especially designed for ultimate thermal management design and component assembly flexibility. Thermally conductive cure-in-place liquid Gap Fillers are an alternate to classical Pads that dispense efficiently, have high thermal performance as well as can be fully automated in processing.

Author: Holger Schuh

Webinar discussing Henkel's new test vehicle, and how it addresses miniaturization realities.