BERGQUIST® GAP FILLER TGF 1100SF
Tuntud kui Gap Filler 1100SF
Omadused ja eelised
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 1100SF is a two component, thermally conductive, silicone free liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. It helps reduce thermal stresses during operation.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Dielektriline konstant, @ 1kHz | 5.0 |
| Kasutusaeg, @ 25.0 °C | 4.0 tund |
| Kõlblikkusaeg | 6.0 kuu |
| Kõvenemisaeg, Soovitatav @ 25.0 °C | 24.0 tund |
| Mahu resistiivsus | 1×10 Ohm m |
| Seguvahekord, mahu järgi | 1 : 1 |
| Seguvahekord, massi järgi | 1 : 1 |
| Shore’i kõvadus, Thirty second delay value, ASTM D2240 Shore 00 | 60.0 |
| Soojusjuhtivus | 1.1 W/mK |
| Soojusmahtuvus, ASTM E1269 | 0.9 J/g-K |
| Säilitustemperatuur | 25.0 °C |
| Tihedus | 2.0 g/cm³ |
| Vaik | |
| Värvus, Vaik | Kollane |
| Tugevdaja | |
| Värvus, Tugevdaja | Punane |
BERGQUIST® GAP FILLER TGF 1100SF
BERGQUIST GAP FILLER TGF 1100SF is a silicone free (SF), high-performance gap filler ideal for fragile and low stress applications.