LOCTITE® 3619
Elementi i pogodnosti
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
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Dokumenti i preuzimanja
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Tehnički podaci
| Broj komponenti | 1 deo |
| Casson viskoznost, kugla / pločae Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| Fizički oblik | Pasta |
| Raspored polimerizacije, @ 100.0 °C | 30.0 minuta |
| Sila smicanja, Čelik (peskirani) | 2030.0 psi |
| Temperatura čuvanja | 2.0 - 8.0 °C |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive