LOCTITE® 3619
特長および利点
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
詳細はこちら
技術情報
| Casson粘度、コーン＆プレート Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 パスカル秒 |
| せん断強度, 鋼（グリットブラスト） | 2030.0 psi |
| 保存温度 | 2.0 - 8.0 °C |
| 外観 | ペースト |
| 形態 | 1液 |
| 硬化スケジュール, @ 100.0 °C | 30.0 分 |
| 硬化タイプ | 熱硬化 |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive