LOCTITE® 3619
Lastnosti in prednosti
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
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Dokumenti in prenosi
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Tehnične informacije
| Fizična oblika | Pasta |
| Način strjevanja | Strjevanje na podlagi toplote |
| Strižna trdnost, Jeklo (peskano) | 2030.0 psi |
| Temperatura skladiščenja | 2.0 - 8.0 °C |
| Urnik strjevanja, @ 100.0 °C | 30.0 min. |
| Viskoznost po Cassonu, stožec in plošča Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| Število komponent | 1 Del |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive