LOCTITE® 3619
Omadused ja eelised
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
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Tehniline teave
| Füüsiline vorm | Pasta |
| Kasseti viskoossus, koonus ja plaat Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| Komponentide arv | 1-komponentne |
| Kõvenemisaeg, @ 100.0 °C | 30.0 minut |
| Nihkejõud, Teras (abrasiivpulber) | 2030.0 psi |
| Säilitustemperatuur | 2.0 - 8.0 °C |
| Tahkumistüüp | Kuumkõvenemine |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive