LOCTITE® 3619
Features and Benefits
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
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Technical Information
| Casson viscosity, cone & plate Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| Cure schedule, @ 100.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Number of components | 1 part |
| Physical form | Paste |
| Shear strength, Steel (grit blasted) | 2030.0 psi |
| Storage temperature | 2.0 - 8.0 °C |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive