LOCTITE® 3619
功能與優點
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
瞭解更多
技術資訊
| 儲存溫度 | 2.0 - 8.0 °C |
| 剪切強度, 鋼（噴砂） | 2030.0 psi |
| 卡森粘度，錐型和板型，Haake PK100、M10/PK1，2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| 固化類型 | 熱固化 |
| 建議固化方式, @ 100.0 °C | 30.0 分 |
| 物理形態 | 黏貼 |
| 零組件數 | 1 組分 |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive