LOCTITE® 3619
Características y Ventajas
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive
LOCTITE® 3619 is designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Particularly suited where low curing temperatures are required with heat sensitive components, and in applications where short curing times are required.
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Información técnica
| Casson viscosidad, cono & placa Haake PK100, M10/PK1, 2°, @ 25.0 °C | 1.0 - 4.0 Pa∙s |
| Forma física | Pasta |
| Número de componentes | Monocomponente |
| Programa de curado, @ 100.0 °C | 30.0 min |
| Resistencia al corte, Acero (granallado) | 2030.0 psi |
| Temperatura de almacenaje | 2.0 - 8.0 °C |
| Tipo de curado | Curado Térmico |
LOCTITE® 3619
LOCTITE 3619, Epoxy, Low cure temperature, Surface mount adhesive