LOCTITE® ABLESTIK 8008HT
Zināms kā ABLECOAT 8008HT
Iezīmes un ieguvumi
A 1-part, proprietary hybrid-chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high-power devices in a high-UPH environment.
LOCTITE® ABLESTIK 8008HT die-attach adhesive is perfect for high-power devices in a high-UPH environment. A lead-free alternative to soft solder and eutectic, it can potentially reduce the layers of backside metallisation required. It can be applied to a wafer backside by stencil printing, B-staged in an oven, then be cured after die attach in an in-line process exhibiting a consistent, void-free bond line without bleed. Should be used with a pressure-sensitive dicing tape. Not compatible with UV dicing tapes.
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Tehniskā informācija
| Iegūstamais jonu saturs, Hlorīds (CI-) | 9.0 ppm |
| Iegūstamais jonu saturs, Kālijs (K +) | 9.0 ppm |
| Iegūstamais jonu saturs, Nātrijs (Na +) | 9.0 ppm |
| Karstā spiedogabīdes izturība, @ 260.0 °C 2 x 2 mm Si die on Cu LF | 2.6 kg-f |
| Krāsa | Sudraba |
| Pielietojumi | Spiedoga pievienošana |
| RT spiedoga bīdes izturība, 2 x 2 mm Si die on Cu leadframe | 6.0 kg-f |
| Sacietināšanas veids | Sacietināšana karsējot |
| Siltumvadītspēja | 11.0 W/mK |
| Stiepes modulis, @ 250.0 °C | 2451.0 N/mm² (355340.0 psi ) |
| Stikla pārejas temperatūra (Tg) | 264.0 °C |
| Termiskās izplešanās koeficients (CTE) | 37.0 ppm/°C |
| Termiskās izplešanās koeficients (CTE), Above Tg | 62.0 ppm/°C |
| Tiksotropiskais indekss | 4.0 |
| Tilpuma pretestība | 0.00005 Ohm cm |
| Viskozitāte, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 50000.0 mPa.s (cP) |
| Ārstēšanas grafiks, Snap Cure @ 170.0 °C | 20.0 sek. |
LOCTITE® ABLESTIK 8008HT
A 1-part, proprietary hybrid-chemistry, lead-free, electrically and thermally conductive die-attach adhesive specifically formulated for high-power devices in a high-UPH environment.