LOCTITE® ABLESTIK 8008HT

Known as ABLECOAT 8008HT

Features and Benefits

LOCTITE ABLESTIK 8008HT, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK 8008HT adhesive is designed for high power devices in high UPH environment. It offers a lead-free alternative to soft solder and eutectic and can potentially reduce the layers of backside metallization required. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008HT should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 37.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 62.0 ppm/°C
Colour Silver
Cure schedule, Snap Cure @ 170.0 °C 20.0 sec.
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 9.0 ppm
Extractable ionic content, Potassium (K+) 9.0 ppm
Extractable ionic content, Sodium (Na+) 9.0 ppm
Glass transition temperature (Tg) 264.0 °C
Hot die shear strength, @ 260.0 °C 2 x 2 mm Si die on Cu LF 2.6 kg-f
RT die shear strength, 2 x 2 mm Si die on Cu leadframe 6.0 kg-f
Tensile modulus, @ 250.0 °C 2451.0 N/mm² (355340.0 psi )
Thermal conductivity 11.0 W/mK
Thixotropic index 4.0
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 50000.0 mPa·s (cP)
Volume resistivity 0.00005 Ohm cm