LOCTITE® 3517M
Značajke i prednosti
One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M™ is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Dokumenti i preuzimanja
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Tehnički podaci
| Koeficijent toplinske ekspanzije (CTE) | 65.0 ppm/°C |
| Koeficijent toplinske ekspanzije (CTE), Above Tg | 191.0 ppm/°C |
| Temperatura prelaska u staklo (Tg) | 78.0 °C |
| Viskoznost, Haake PK1.2 | 2600.0 mPa.s (cP) |
| Zakazano blago stvrdnjavanje | 30.0 mW/cm² |
| Zakaži stvrdnjavanje, Preporučeno @ 120.0 °C | 5.0 min. |
LOCTITE® 3517M
One-part, reworkable epoxy underfill for CSP and BGA production.