LOCTITE® 3517M
特長および利点
One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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技術情報
| ガラス転移温度 (Tg) | 78.0 °C |
| 熱膨張率 | 65.0 ppm/°C |
| 熱膨張率, Above Tg | 191.0 ppm/°C |
| 硬化スケジュール, 推奨 @ 120.0 °C | 5.0 分 |
| 硬化スケジュール光強度 | 30.0 mW/cm² |
| 粘度、Haake PK1.2 | 2600.0 mPa.s (cP) |
LOCTITE® 3517M
One-part, reworkable epoxy underfill for CSP and BGA production.