LOCTITE® 3517M

Elementi i pogodnosti

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One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Tehnički List
LOCTITE® 3517M
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Tehnički podaci

Intenzitet rasporeda svetlosne polimerizacije 30.0 mW/cm²
Koeficijent toplotnog širenja (CTE) 65.0 ppm/°C
Koeficijent toplotnog širenja (CTE), Above Tg 191.0 ppm/°C
Raspored polimerizacije, Preporučeno @ 120.0 °C 5.0 minuta
Temperatura razmekšavanja (Tg) 78.0 °C
Viskoznost, Haake PK1.2 2600.0 mPa.s (cP)