LOCTITE® 3517M
Merkmale und Vorteile
One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M™ is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M™ is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Technische Informationen
| Aushärtezyklus, Empfohlen @ 120.0 °C | 5.0 Min. |
| Aushärtungsplan Lichtintensität | 30.0 mW/cm² |
| Glasübergangstemperatur (Tg) | 78.0 °C |
| Viskosität, Haake PK1.2 | 2600.0 mPa.s (cP) |
| Wärmeausdehnungskoeffizient (CTE) | 65.0 ppm/°C |
| Wärmeausdehnungskoeffizient (CTE), Above Tg | 191.0 ppm/°C |
LOCTITE® 3517M
One-part, reworkable epoxy underfill for CSP and BGA production.