LOCTITE® 3517M

Caractéristiques et avantages

One-part, reworkable epoxy underfill for CSP and BGA production.
If you want a reliable underfill for Ball Grid Array (BGA) and chip scale packaging (CSP), LOCTITE® 3517M is recommended. This black-liquid, epoxy-based underfill solution is designed for the production of CSPs and BGAs. LOCTITE® 3517M is particularly ideal for soldering joint protection against mechanical stress in hand-held electronic device applications.
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Informations techniques

Coefficient de dilatation thermique (CDT) 65.0 ppm/°C
Coefficient de dilatation thermique (CDT), Above Tg 191.0 ppm/°C
Intensité légère programme de durcissement 30.0 mW/cm²
Programme de durcissement, Recommandé @ 120.0 °C 5.0 min
Température de transition vitreuse 78.0 °C
Viscosité, Haake PK1.2 2600.0 mPa.s (cP)