BERGQUIST® GAP PAD® TGP HC1000
Tuntud kui Gap Pad® HC1000
Omadused ja eelised
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material
BERGQUIST® GAP PAD TGP HC1000 is an extremely conformable, low-modulus polymer that acts as a thermal interface and electrical insulator between electronic components and heat sinks. The “gel-like” modulus allows this material to fill air gaps to enhance the thermal performance of electronic systems. BERGQUIST GAP PAD TGP HC1000 is offered with removable protective liners on both sides of the material.
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Tehniline teave
| Arvestuslik leegikindlus | V-0 |
| Kanduri tüüp | Klaaskiud |
| Soojusjuhtivus | 0.1 W/mK |
| Standardpaksus | 0.254 - 0.508 mm |
| Töötemperatuur | -60.0 - 200.0 °C |
| Värvus | Hall |
| Youngi moodul, ASTM D575 | 275.0 KPa (40.0 psi ) |
BERGQUIST® GAP PAD® TGP HC1000
BERGQUIST GAP PAD TGP HC1000, “Gel-Like” Modulus Gap Filling Material