BERGQUIST® GAP PAD® TGP 3500ULM
Zināms kā Gap Pad® 3500ULM
Iezīmes un ieguvumi
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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Tehniskā informācija
| Darbības temperatūra | -60.0 - 200.0 °C |
| Junga modulis | 27.5 KPa (4.0 psi ) |
| Krāsa | Pelēka |
| Liesmas novērtējums | V-0 |
| Nesēja veids | Bez stikla šķiedras, Stikla šķiedra |
| Siltumvadītspēja | 3.5 W/mK |
| Standarta biezums | 0.508 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 3500ULM
A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).