BERGQUIST® GAP PAD® TGP 3500ULM

Žinoma kaip Gap Pad® 3500ULM

Savybės ir privalumai

A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
Aprašymas

Techniniai duomenys

Darbinė temperatūra -60.0 - 200.0 °C
Liepsnos įvertinimas V-0
Nešančiosios medžiagos tipas Ne pluoštinis stiklas, Stiklo pluoštas
Spalva Pilka
Standartinis storis 0.508 - 3.175 mm
Šilumos laidumas 3.5 W/mK
„Young“ modulis 27.5 KPa (4.0 psi )