BERGQUIST® GAP PAD® TGP 3500ULM

Tuntud kui Gap Pad® 3500ULM

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A thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 3.5 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 3500ULM is an extremely soft thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
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BERGQUIST GAP PAD TGP 3500ULM
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Lisadokumendid

Selection Guide: Thermal Interface Materials Selection
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Eesti

Tehniline teave

Arvestuslik leegikindlus V-0
Kanduri tüüp Klaaskiud, Mitteklaaskiud
Soojusjuhtivus 3.5 W/mK
Standardpaksus 0.508 - 3.175 mm
Töötemperatuur -60.0 - 200.0 °C
Värvus Hall
Youngi moodul 27.5 KPa (4.0 psi )