LOCTITE® ECCOBOND UF 3912
Features and Benefits
LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant
LOCTITE® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications.
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Technical Information
| Applications | Encapsulating, Underfilling |
| Coefficient of thermal expansion (CTE), Above Tg | 105.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 28.0 ppm/°C |
| Colour | Black |
| Cure schedule, @ 160.0 °C | 7.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 127.0 °C |
| Storage modulus, DMA @ 25.0 °C | 8100.0 N/mm² |
| Storage temperature | -40.0 °C |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 20 rpm | 3500.0 mPa·s (cP) |
LOCTITE® ECCOBOND UF 3912
LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant