LOCTITE® ABLESTIK 2000

Known as ABLEBOND 2000 (3.6G)

Features and Benefits

LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive
LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
  • Proprietary hybrid chemistry
  • Pb-free applications
  • Ultra-low moisture absorption
  • High hot/wet adhesion
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 65.0 ppm/°C
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 1.0 ppm
Extractable ionic content, Potassium (K+) 1.0 ppm
Extractable ionic content, Sodium (Na+) 1.0 ppm
Hot die shear strength 8.0 kg-f
RT die shear strength 16.0 kg-f
Tensile modulus, DMTA @ 250.0 °C 193.0 N/mm² (28000.0 psi )