LOCTITE® ABLESTIK 2000
被稱為 ABLEBOND 2000 (3.6G)
功能與優點
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive
LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
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技術資訊
| RT 模剪切強度 | 16.0 kg-f |
| 可萃取出的離子含量, 氯化物(CI-) | 1.0 ppm |
| 可萃取出的離子含量, 鈉(Na+) | 1.0 ppm |
| 可萃取出的離子含量, 鉀(K+) | 1.0 ppm |
| 固化類型 | 熱固化 |
| 應用 | 晶片焊接 |
| 拉伸模量, DMTA @ 250.0 °C | 193.0 N/mm² (28000.0 psi ) |
| 熱模剪切強度 | 8.0 kg-f |
| 熱膨脹係數 (CTE) | 65.0 ppm/°C |
LOCTITE® ABLESTIK 2000
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive