High-visibility masking material, low-voiding and jetting solder pastes on display.

Henkel’s latest innovation overcomes performance and processability challenges of traditional materials.

Developmental Silicone-Free Liquid TIM, Ultra-Soft Gap Pad® top Product Lineup.

New solutions for advanced semiconductor packaging, automotive and industrial electronics applications.

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material

EMI Shielding and Thermal Interface Materials take Top Honors

New center offers hands-on customer training in latest vehicle repair methods

Henkel offers a comprehensive training portfolio supporting professionals at tape and label producers, printers or manufacturers of PSA-based specialties