Irvine, California – As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating.  Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel today announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components.

BERGQUIST® LIQUI-FORM® TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and in use.  The material, which can accommodate gaps up to 3.0 mm, offers production simplicity as the pre-cured formulation requires no mixing or refrigeration.  Once applied, the 6.0 W/m-K TIM gel maintains its form and position, which is critical for telecom devices that may be placed vertically in outdoor environments...

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...

Irvine, California – Henkel today announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high-power density challenges associated with new 5G telecom infrastructure and consumer mobility designs.  BERGQUIST GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today.  

“Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue...

Press release on awards given to Henkel materials at IPC APEX EXPO 2019

High-performance material raises device reliability within challenging environments

Focus on enhanced sustainability, greater cost-efficiency and new alloy substrates

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material