Henkel Showcases Latest Adhesive Technologies Solutions at SEMICON Europa New solutions for advanced semiconductor packaging, automotive and industrial electronics applications. Read More
Henkel Highlights Thermal Management Solutions at The Battery Show North America 2018 Henkel highlights its latest TIM products, as well as its connecting and protecting materials in booth 311 from September 11 – 13 at The Battery Show North America 2018. Read More
Henkel to Partner with HP to Develop 3D Material Solutions Henkel Adhesive Technologies has joined the HP Open Materials and Applications Platform and will work with HP in its Corvallis, Oregon 3D Materials and Applications lab to develop customized, industry-specific solutions for HP Multi Jet Fusion™ customers. Read More
Henkel’s Automotive Thermal Management Expertise on Display at Battery Show Europe 2018 Developmental Silicone-Free Liquid TIM, Ultra-Soft Gap Pad® top Product Lineup. Read More
Henkel’s Temperature Stable LOCTITE GC 10 Solder Paste Living Up to its Game-Changing Promise Perfect, consistent results with no refrigeration changing traditional working models. Read More
Henkel Develops Advanced Solder Paste Test Vehicle Novel test vehicle addresses miniaturization realities. Read More
New Liquid GAP FILLER from Henkel Delivers Thermal Control, Automation and Reworkability Peelable TIM formulation enables easy assembly rework. Read More
2018-12-10 High Operating Temperature Underfill from Henkel Delivers Protection for Aero and Auto Electronics High-performance material raises device reliability within challenging environments Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
