There is an increasing demand for medical protective wear in these times after the coronavirus outbreak. Henkel contributes with know-how and adhesive solutions.

Irvine, California – Henkel today announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high-power density challenges associated with new 5G telecom infrastructure and consumer mobility designs.  BERGQUIST GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today.  

“Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue...

Novel test vehicle addresses miniaturization realities.

Henkel and Covestro combine their strengths to promote e-mobility 

This system has been designed for reactive polyurethane (PUR) based adhesives systems and coatings.

Henkel announces it has signed an agreement to acquire the privately-held global thermal management solutions supplier The Bergquist Company.

EMI Shielding and Thermal Interface Materials take Top Honors

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material

Peelable TIM formulation enables easy assembly rework.