Irvine, CA – Anticipating the requirements for next-generation high-reliability electronics applications, Henkel Corporation today announced the development of LOCTITE^® ECCOBOND^® UF 1173. The protective underfill material, which has been formulated with health and safety top-of-mind, does not contain any reportable REACH SVHCs*, is not CMR classified and delivers outstanding performance under high operating temperature environments.  

“The miniaturization trend is now firmly part of the automotive and aerospace sectors, particularly for advanced driver assistance system (ADAS) technologies such as cameras, radars and lidars; as well as aerospace, satellite and UAV applications,” says Henkel Global Market Segment Head for ADAS and Safety, Vinod Partha. “The use of fine-pitch array devices such as BGAs and CSPs within these systems has increased dramatically, making interconnect protection a critical component for long-term reliability and performance...

New solutions for advanced semiconductor packaging, automotive and industrial electronics applications.

Henkel’s latest innovation overcomes performance and processability challenges of traditional materials.

Discover the unique technical benefits and cost advantages of BONDERITE^® M-PP for protecting steel from corrosion.