LOCTITE® ABLESTIK 2035SC

Omadused ja eelised

This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Tehniline teave

Ekstraheeritav ioonisisu, Kaalium (K+) 19.0 ppm
Ekstraheeritav ioonisisu, Kloriid (CI-) 29.0 ppm
Ekstraheeritav ioonisisu, Naatrium (Na+) 89.0 ppm
Klaasistumistemperatuur (Tg) 120.0 °C
Kuumlõike nihkejõud 7.0 kg-f
Kõvenemisaeg, Soovitatav @ 110.0 °C 90.0 sekund
Peamised omadused Juhtivus: Elektrit mitte-juhtiv
RT kuumlõike nihkejõud 25.0 kg-f
Rakendused Stantskinnitus
Soojusjuhtivus 0.35 W/mK
Soojuspaisumise koefitsient (CTE) 54.0 ppm/°C
Soojuspaisumise koefitsient (CTE), Above Tg 128.0 ppm/°C
Tahkumistüüp Kuumkõvenemine
Tiksotroopne indeks 4.2
Tõmbemoodul, DMTA @ 25.0 °C 68.0 N/mm² (10000.0 psi )
Viskoossus, Brookfield CP51, @ 25.0 °C Speed 5 rpm 11000.0 mPa.s (cP)