Developing adhesive solutions for paper convenience items

Expert talk with Nicolas Riem on xEVs and battery performance

Scrunchable, robust and versatile – flexible packaging for potato chips, fruit juices, coffee, detergents and even adhesives are an attractive proposition. However, these so-called laminates have the disadvantage that they are sometimes difficult to return to the economy.

Global demand for new aircrafts will be as high of 40,000 units over the next two decades. As the worldwide fleet of commercial airlines doubles by 2035, airlines will need to work with adaptable manufacturers who can guarantee short delivery times, rapid reactivity, efficient logistics supply chain and quality traceability.

The rapidly evolving aerospace market calls for a solid supply chain where, from the delivery of incoming raw materials on our receiving dock to the finished product at the customer’s application point, transparency and traceability will remain paramount. 

Balancing high performance and low environmental impact. The aviation industry is committed to delivering sustainable products and services to meet strict regulations and requirements.

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.

Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications.

Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

Global demand for new aircrafts will be as high of 40,000 units over the next two decades. As the worldwide fleet of commercial airlines doubles by 2035, airlines will need to work with adaptable manufacturers who can guarantee short delivery times, rapid reactivity, efficient logistics supply chain and quality traceability.

The rapidly evolving aerospace market calls for a solid supply chain where, from the delivery of incoming raw materials on our receiving dock to the finished product at the customer’s application point, transparency and traceability will remain paramount. 

At the end of 2018, Henkel concluded a partnership with Bilfinger Industrial Services GmbH to provide innovative solutions with Loctite Composite System Pipe Repair. 

As the automotive industry goes through its most disruptive transformation in over 100-years, Henkel is driving the future of e-mobility.

Cover almost all your bonding needs with just 2 adhesives! Bond materials with different properties, do more repairs faster, remove all your designing limitations! Find out more by joining us in one of our webinars or live demos & other events.

The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.