The amount of aluminum used in automotive production is steadily increasing, as automakers and auto suppliers are reducing  the weight of cars in order to meet the latest legislations on fuel consumption.

Film and paste adhesives, wet peel-ply and potting compounds enable the aviation industry to utilize advanced materials that contribute to lightweighting, more efficient designs, and improved sustainability.

The 21^st century has seen the continued rise of “smart” devices. Within two short decades the Internet of Things (IoT) has become embedded into virtually every facet of global culture.

Reliable and process-optimized stator ring potting solution

1K, cure-in-place liquid Thermal Interface Material based on silicone-free chemistry

Discover our customer's success with elastic structural adhesive and volatile controlled thermal interface material for large curved display

Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques.

When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten.

Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications.

Heat seal coating with LOCTITE LIOFOL HS 1138 – enabling resource reduction and recyclability for your food packaging

LOCTITE LIOFOL HS 2809-22 RE – a heat sealable coating for primary and secondary packaging applications

LOCTITE LIOFOL CS 22-422 RE – a versatile cold sealable coating for food and non-food packaging.

Henkel Lab Chats: Video Series around Henkel Automotive solutions

Optimizing hot melt adhesive for consumer packaging