Film and paste adhesives, wet peel-ply and potting compounds enable the aviation industry to utilize advanced materials that contribute to lightweighting, more efficient designs, and improved sustainability.

The 21^st century has seen the continued rise of “smart” devices. Within two short decades the Internet of Things (IoT) has become embedded into virtually every facet of global culture.

Henkel’s BONDERITE® LineguardX offers whip-smart manufacturing technology that provides early warnings of pending danger, stepped-up quality, a reduced scrap rate, less downtime and virtual customer services. 

1K, cure-in-place liquid Thermal Interface Material based on silicone-free chemistry

Discover our customer's success with elastic structural adhesive and volatile controlled thermal interface material for large curved display

Thermally conductive adhesives provide many advantages over traditional mechanical fastening techniques.

When QFN and other bottom-terminated devices are soldered using solder paste at atmospheric pressure, some voiding is always observed. The process of void formation during reflow is dynamic; voids, primarily formed from volatilized flux materials and soldering reaction products, grow, coalesce and then vent at the margins of the solder joint while the solder is molten.

Electronics packaging has utilized one-part and two-part liquid adhesives and sealants for many years. Solid thermal interface pads or sheets have also been widely used in electronics applications.

Irvine, California – Henkel today announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high-power density challenges associated with new 5G telecom infrastructure and consumer mobility designs.  BERGQUIST GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today.  

“Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue...

Irvine, California – As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating.  Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel today announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components.

BERGQUIST® LIQUI-FORM® TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and in use.  The material, which can accommodate gaps up to 3.0 mm, offers production simplicity as the pre-cured formulation requires no mixing or refrigeration.  Once applied, the 6.0 W/m-K TIM gel maintains its form and position, which is critical for telecom devices that may be placed vertically in outdoor environments...

Heat seal coating with LOCTITE LIOFOL HS 1138 – enabling resource reduction and recyclability for your food packaging

Henkel Lab Chats: Video Series around Henkel Automotive solutions

Optimizing hot melt adhesive for consumer packaging

As the automotive industry goes through its most disruptive transformation in over 100-years, Henkel is driving the future of e-mobility.

Discover Henkel's automotive web-seminar series designed to keep you up-to-date on the latest technology innovations

Learn more about Henkel's highly reliable solutions for Electronic Control Units (ECU).

On Oct 13, join Henkel to learn how material solutions are enabling a no compromise approach to next generation vehicle design and manufacturing.