Developing adhesive solutions for paper convenience items

Expert talk with Nicolas Riem on xEVs and battery performance

No matter the application, if you’re dealing with an assembly that has seen its share of wear and tear, you may come across a stripped thread. When that happens, you should install a helicoil to create a new thread for a fastener to grip.

Henkel opened its new aerospace adhesives manufacturing facility in Montornès, Spain. This dedicated and cutting-edge production site provides valuable production capacity to support aerospace manufacturers and their suppliers.

LOCTITE^® resins and adhesives made it possible to develop composite rims that increase driving performance while being lighter, more durable and fatigue resistant.

Our LOCTITE^® MAX 3 matrix resin and our adhesives were vital parts in the development of the composite doors for the Roding Roadster that heavily reduce weight while being more robust.

Henkel has developed a new die attach formulation designed for exceptionally fast processing and compatibility with the most widely used encapsulants in the market.

Recognizing the challenges, specialists across industry, material suppliers and the academic community set out to develop an alloy that could meet or exceed the high-temperature, high-reliability requirements necessary for automotive and military applications.

Consumer and automotive markets hold the answer for now, but other market sectors such as medical are also beginning to incorporate MEMS devices.

Henkel opened its new aerospace adhesives manufacturing facility in Montornès, Spain. This dedicated and cutting-edge production site provides valuable production capacity to support aerospace manufacturers and their suppliers.

Thermal Control, Ease of Use, Dispense Capability and Reworkability in a Single Material

Peelable TIM formulation enables easy assembly rework.

Henkel structural adhesives help to offset the added weight of a Battery Electric Vehicle, while offering improved crashworthiness capabilities.

A step-by-step cleaner guide for systems running with pressure sensitive adhesives.

The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi

With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.