by Justin Kolbe

Market Strategy Head - Power & Industrial Automation

by Wayne Eng
Market Strategy Head - Telecom & Datacom

By Patric Scheidner
Corporate Vice President Global Head of Aviation, Space, Rail

Secure and serviceable gasketing battery protection solution

Discover how our extensive automotive solution portfolio is leading to our customers’ successes

Silicone-free, fast-dispensable battery pack thermal management solution

New thermal gel solutions for Advanced Driver-Assistance Systems (ADAS)  – covering cameras, radars and light detection.

Download Henkel's white paper on optimizing structural adhesives for next generation vehicle design and application

Download Henkel's white paper on the use of structural tapes and patches to stiffen body panels on a variety of metal types.

LOCTITE LIOFOL HS 2809-22 RE – a heat sealable coating for primary and secondary packaging applications

Irvine, California – As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating.  Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel today announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components.

BERGQUIST® LIQUI-FORM® TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and in use.  The material, which can accommodate gaps up to 3.0 mm, offers production simplicity as the pre-cured formulation requires no mixing or refrigeration.  Once applied, the 6.0 W/m-K TIM gel maintains its form and position, which is critical for telecom devices that may be placed vertically in outdoor environments...

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...

Optimizing hot melt adhesive for consumer packaging

Henkel structural adhesives help to offset the added weight of a Battery Electric Vehicle, while offering improved crashworthiness capabilities.

Clean machines and safe cleaning products are cornerstones for product safety.

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