Advancements in electrification and lithium-ion batteries are driving serious growth in the all-electric vehicles (EV) and hybrid electric vehicle (HEV) space.

Advancements in electrification and lithium-ion batteries are driving serious growth in the all-electric vehicles (EV) and hybrid electric vehicle (HEV) space.

Thanks to 3-D printing and the support of LOCTITE^® products, 4moms is able to achieve rapid product development in a demanding market.

LOCTITE^® products are used to provide reliability along the whole manufacturing process: assembly of hydraulic pipes, fixing of hydraulic pipe systems, raw material processing for propeller hubs, securing of steering mechanisms, end cap fixing on hub shafts, and securing dowel pins for propeller blades.

Herrenknecht is the world's leading manufacturer of tunnel boring machines, with 100 machines at work on projects ranging from traffic tunnels in Kuala Lumpur to the Paris metro.

In this technical article, Henkel presents its findings on the relationship among component size and type, stencil design rules and solder paste characteristics to the occurrence mid-chip balling.

Henkel’s new BERGQUIST GAP PAD material, GAP PAD HC 5.0 is formulated on an entirely new chemistry platform with unique filler technology, created for the increasing requirement for lower-stress materials for next-generation high power density devices.

Henkel has developed a waterproof sealing adhesive for camera module lens bonding — yet another milestone on the path to fully waterproofed smartphone and wearable devices.

Henkel announces it has signed an agreement to acquire the privately-held global thermal management solutions supplier The Bergquist Company.

In this segment of On the Road with Henkel, we take a closer look at how adhesives will enable these vehicle interiors of the future.

The increased adoption of Smart Cards has largely been driven by the global acceptance of the EMV standard for efficient banking and payment infrastructure implementations, along with higher capacity requirements in telecommunications and secure administrative processes for personal identification and access control.

Smart Cards, however, are only as good as the reliability provided by the materials that enable their production. Selecting the most effective adhesive solutions that exceed stringent manufacturing and end-use requirement is essential. This webinar will present information about Smart Card market trends, future growth drivers and details on materials that provide essential Smart Card quality and reliability.

Jinu Choi is a Market Development Manager at Henkel Electronic Materials responsible for global product strategy and business development of advanced materials.

Author: Jinu Choi

With the trend towards sensing functionalities, the number of semiconductor-based sensors is growing fast. Such sensors often contain temperature sensitive substrates and components (like MEMS), which limit the processing of thermally-cured adhesives and encapsulants to maximum 80°C. Next to this, more accurate sensing also requires low stress and low warpage adhesives for constant and stable functionality over operating temperature range. This webinar presents new materials for MEMS, CMOS image and fingerprint sensor type assemblies fulfilling such requirements.

Author: Ing. Ruud de Wit

The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate.