LOCTITE® ABLESTIK ECF 550

Merkmale und Vorteile

LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.
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Technische Informationen

Aushärtetechnik Aushärtung durch Wärme
Aushärtezyklus, @ 150.0 °C 30.0 Min.
Glasübergangstemperatur (Tg) 81.0 °C
Physikalische Form Film
Scherfestigkeit, Aluminium 20.0 psi
Träger Glasgewebe
Trägerfilmdicke 1.0 mil
Wärmeleitfähigkeit 1.0 W/mK