LOCTITE® ABLESTIK ECF 550
Features and Benefits
LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.
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Technical Information
| Carrier film thickness | 1.0 mil |
| Carrier type | Glass fabric |
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 81.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 20.0 psi |
| Thermal conductivity | 1.0 W/mK |
LOCTITE® ABLESTIK ECF 550
LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly