LOCTITE® ABLESTIK ECF 550
Elementi i pogodnosti
LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.
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Dokumenti i preuzimanja
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Tehnički podaci
| Debljina nosećeg filma | 1.0 mil |
| Fizički oblik | Folija |
| Raspored polimerizacije, @ 150.0 °C | 30.0 minuta |
| Sila smicanja, Aluminijum | 20.0 psi |
| Temperatura razmekšavanja (Tg) | 81.0 °C |
| Tip nosača | Staklena vlakna |
| Tip očvršćavanja | Očvršćavanje pomoću zagrevanja |
| Toplotna provodljivost | 1.0 W/mK |
LOCTITE® ABLESTIK ECF 550
LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly