LOCTITE® ABLESTIK ECF 550

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LOCTITE ABLESTIK ECF 550, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 550 adhesive is designed for microelectronic applications which require electrical conductivity. When used for substrate attach, this adhesive film acts as an electrical ground plane. In the assembly and sealing of microelectronic packages which require RF shielding, LOCTITE ABLESTIK ECF 550 film adhesive maintains electrical continuity between joints.
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Füüsiline vorm Kile
Kanduri tüüp Klaasriie
Kandurkile paksus 1.0 mil
Klaasistumistemperatuur (Tg) 81.0 °C
Kõvenemisaeg, @ 150.0 °C 30.0 minut
Nihkejõud, Alumiinium 20.0 psi
Soojusjuhtivus 1.0 W/mK
Tahkumistüüp Kuumkõvenemine