LOCTITE® ABLESTIK 2030SC

Known as ABLEBOND 2030SC (45G)

Features and Benefits

This flexible, hybrid-based die attach adhesive is designed for fast curing, high throughput component assemblies, and is suitable for a variety of package sizes.
For high throughput die attach applications with dissimilar surfaces – and a superior performance compared to soldering – choose LOCTITE® ABLESTIK 2030SC. This hybrid technology adhesive is specially formulated to reduce stress and warpage, and is snap curable – 1.5 minutes at 110°C (230°F) – supporting fast handling.
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Technical Information

Applications Die attach
Cure type Heat cure
Extractable ionic content, Chloride (CI-) 19.0 ppm
Extractable ionic content, Potassium (K+) 4.0 ppm
Extractable ionic content, Sodium (Na+) 29.0 ppm
Hot die shear strength 0.96 kg-f
RT die shear strength, 2 x 2 mm Si die on Pd 1.9 kg-f
Tensile modulus, @ 250.0 °C 450.0 N/mm² (65000.0 psi )
Thixotropic index 4.6