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Today’s consumers want smaller devices, more functionality, outstanding reliability and, of course, lower cost. When it comes to semiconductor packaging, it’s possible to have it all with material solutions from Henkel. As a total solutions provider, Henkel not only leverages its extensive global coverage and manufacturing network to deliver superior technologies, but ensures regional support for its customers with customized solutions. With our long standing expertise, we deliver a broad technology tool box and application know-how including resin and filler technology.

With a focus on fostering technology leadership with strong innovations, Henkel offers applications that not only respond to, but drive, the development of the future of electronics. From die attach adhesives to liquid and film encapsulants, conductive coatings for EMI shieldings, first level underfills such as liquid and film, to thermal interface materials and conductive and non conductive adhesives for sensors and modules, our customers can be certain their needs will not only be met, but covered by the most cutting edge and reliable technologies on the market.

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