Henkel Webinars - Aerospace and Rail Transportation Expert Talks The Expert Talks webinar series offers in-depth discussions with experts on diverse topics. Read More
Henkel Partners With Semicon Southeast Asia 2022 On June 22nd 2022, join us to learn more about solutions to high power advanced semiconductor packaging Read More
Henkel partners with Sustainability in Packaging Asia 2022 Learn more about REThink Packaging – Mono Material Packaging Read More
Low temperature (UV) dual cure adhesive for heat sensitive electronic applications The number of semiconductor-based sensors is growing rapidly as the demand for sensing functions tends to evolve. Such sensors typically contain heat-sensitive substrates and components (such as MEMS), which limit the processing temperature of thermally cured adhesives and encapsulants to a maximum of 80°C. Read More
Henkel partners with Semicon Southeast Asia 2021 On June 23 – 27, join us to learn more about Semi-Sintering Die Attach Paste for Power and High-Frequency Electronics for best in class thermal performance. Read More
Sustainability Days 2021 The virtual gathering experience of the packaging industry: Conference + In-house Exhibition + Networking Read More
