Introduced in the 1990s in footwear industry, Polyurethane Reactive Hotmelt Adhesive, so called PUR or PURHM, to react with moisture in the air and creates strong crosslinks, which enable them to deliver excellent bonding characteristics and durability. In adhesive technologies, PUR hotmelt is the popular solution for bonding applications relating to packaging and woodworking. 

NASA's Artemis program to return to the moon, fifty years after the last humans walked there, is understandably gaining widespread media interest. 

Digitalization as Essential

‘Digitalization’ is a word used broadly these days. It describes everything from the way we order consumer products on electronic devices to our car-driving experience and the automated efficiency of smart factories. Indeed, digitalization has wide-ranging applications with far-reaching implications. Data-informed eCommerce, predictive AI, 5G and IoT all serve to drive cost optimization, resource conservation, ultra-personalization, and global connectivity, creating value for customers and consumers.

Digitizing operations, communications and customer experiences are vital to Henkel – so much so, in fact, that the company launched a new business unit, Henkel dx, to push the digital innovation envelope and leverage the power of data and analytics across company manufacturing operations, product development, consumer engagement tools and sustainability initiatives.

New Developments in Ultra-Fast EV Charging Move Closer to Fuel Pump Parity

Irvine, CA – Henkel today announced the commercialization of its latest semiconductor-grade capillary underfill (CUF) formulation for advanced packaging applications. The material, Loctite Eccobond UF 9000AG, enables advanced silicon (Si) node flip chip integration by providing robust interconnect protection and compatibility with high-volume manufacturing environments. While the company has well-established pre-applied paste and film underfill materials for leading-edge chip technologies, this development broadens Henkel’s post-applied capillary portfolio for flip chips with advanced node scaling. 

Loctite Eccobond UF 9000AG breaks past conventional formulation paradigms, balancing high filler loading and fast flow capability to meet the extreme reliability and volume demands of next-generation semiconductor device packaging. Already proven in mass production environments with the latest node and currently under evaluation for next generation node flip chip packages,...

Anyone who’s jumped in a cold pool on a hot day understands the effectiveness of liquid cooling.