Semiconductor technology and, specifically, the packaging of semiconductor devices has never touched more applications than it does today.  As all parts of everyday life become increasingly digitalized – from automobiles to home security to smartphones and 5G infrastructure – semiconductor packaging innovation is at the core of responsive, reliable, robust electronic functionality.

Thinner wafers, decreasing footprints, finer pitches, package integration, 3D designs, wafer-level technology and high-volume production economies of scale demand enabling materials that can support innovation ambitions.  Henkel’s total solutions approach leverages extensive global resources to deliver superior semiconductor packaging material technologies and cost-competitive performance.  From die attach adhesives used in traditional wirebond packaging to advanced underfills and encapsulants for advanced packaging applications, Henkel provides the cutting-edge materials technology and global support top microelectronics companies require. 

Wirebond Applications

Advanced Packaging Applications

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