Lid and Stiffener Attach Adhesives
Enabling Low Warpage for High Reliability of Heterogeneous Packages
Advanced flip-chip technology and heterogeneous integration are key enablers of high-performance computing, driving new levels of processing power for desktops, data center servers, autonomous driving systems, and more. Package size, die size, die count, and design complexity are increasing for these applications. The integrity of the complex 2.5D and 3D packages are essential to long-term reliability.
During reliability testing and end-use, these large devices are subjected to multiple thermal cycles where the die and package are susceptible to warpage, which can impact stability and reliability. Likewise, during operation, the thermal load produced by high power advanced packages can be extreme, requiring stability-enhancing materials to enable manufacturing and functional expectations. Henkel's high-performance adhesives' role is to secure package lids and peripheral stiffeners to the substrate to maintain coplanarity, reduce warpage, and provide grounding or shielding capability.
