Innovations in Instant Adhesives & LED Light Cure Adhesives Enable faster production speeds with highly fluorescent adhesives for high speed inspection Read More
LOCTITE® Partners with the TAG Heuer Porsche Formula E Team The TAG Heuer Porsche Formula E Team races in the ABB FIA Formula E World Championship, the most innovative motorsport series. Read More
BONDERITE® Solutions from Henkel Help Automotive Suppliers to Leverage the Growth Potential in Lightweighting Metals One-stop process portfolio for all needs in metal surface treatment Read More
Designed for Recycling: Henkel Launches New Solutions and Receives RecyClass Certification Good Packaging Design Starts With the Right Components Read More
Health and safety products The highest security standards without any compromise on efficiency Read More
2022-04-06 High Thermal Conductivity TIM from Henkel Addresses Reliability Demands Across Digital Applications 10.0 W/m-K BERGQUIST® LIQUI FORM Gel Tackles Heat Management Challenges in High Bandwidth Systems Irvine, CA – Staying ahead of thermal management requirements for increasingly challenging datacom, telecom and industrial automation applications, Henkel today announced the commercialization of its latest gel thermal interface material (TIM), BERGQUIST® LIQUI FORM TLF 10000. The one-part, high thermal conductivity dispensable gel is designed to provide robust heat transfer for high-power electronic components, improving operational efficiency and extending lifetime system reliability. Larger, higher-power devices such as ASICs and FPGAs are the norm in 5G telecom infrastructure gear, data center switches, routers and servers, as well as electric vehicle (EV) infrastructure and industrial automation electronics. As component density and complexity increase in response to faster data processing and ... Read More
