LOCTITE® ABLESTIK 5025E
Caratteristiche e vantaggi
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
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Informazioni tecniche
| Approvazioni / certificazioni / specifiche | MIL Standard 883, Method 5011 |
| Aspetto fisico | Pellicola |
| Conducibilità termica | 6.5 W/mK |
| Resistenza al taglio, Alluminio | 2000.0 psi |
| Schema di polimerizzazione, @ 150.0 °C | 30.0 min. |
| Temperatura di transizione vetrosa (Tg) | 90.0 °C |
| Tipo di polimerizzazione | Polimerizzazione a caldo |
LOCTITE® ABLESTIK 5025E
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.