LOCTITE® ABLESTIK 5025E
Značajke i prednosti
This silver-filled film adhesive provides thin, uniform bondline control and is particularly suited for bonding hot devices onto heat sinks in applications, combining grounding performance with thermal dissipation capabilities.
For a cleaner, no-waste alternative to paste when you’re working with microwave circuitry and heat sink attach applications, LOCTITE® ABLESTIK 5025E is a great choice. This silver-filled electrically conductive thin-film adhesive offers uniform bondline control and excellent thermal and electrical conductivity. Particularly ideal for bonding hot devices onto heat sinks in large bonding area applications, this product provides RF/EMI shielding, passes NASA outgassing standards, and meets MIL-STD-883, Method 5011 requirements.
Dodatne informacije
Dokumenti i preuzimanja
Tražite list s tehničkim podacima ili list sa sigurnosnim podacima na drugom jeziku?
Tehnički podaci
Fizički oblik | Sloj |
Odobrenja/certifikati/specifikacije agencije | MIL Standard 883, Method 5011 |
Snaga smicanja, Aluminij | 2000.0 psi |
Temperatura prelaska u staklo (Tg) | 90.0 °C |
Tip stvrdnjavanja | Toplinsko stvrdnjavanje |
Toplinska vodljivost | 6.5 W/mK |
Zakaži stvrdnjavanje, @ 150.0 °C | 30.0 min. |